描述
1.位元件
FX系列PLC有4種基本編程元件,為了分辨各種編程元件,給它們分別指定了專用的字母符號(hào):
x:輸入繼電器,用于直接輸入給PLC的物理信號(hào)。
Y:輸出繼電器,用于從PLC直接輸出物理信號(hào)。
M(輔助繼電器)和S(狀態(tài)繼電器):PLC內(nèi)部的運(yùn)算標(biāo)志。
上述的各種元件稱為“位(bit)元件”,它們只有兩種不同的狀態(tài),即ON和OFF,可以分別用二進(jìn)制數(shù)l和0來(lái)表示這兩種狀態(tài)。
2.字元件
8個(gè)連續(xù)的位組成一個(gè)字節(jié)(Byte),16個(gè)連續(xù)的位組成一個(gè)字(Word),32個(gè)連續(xù)的位組成一個(gè)雙字(DoubleWord)。定時(shí)器和計(jì)數(shù)器的當(dāng)前值和設(shè)定值均為有符號(hào)字,最高位(第15位)為符號(hào)位,正數(shù)的符號(hào)位為0,負(fù)數(shù)的符號(hào)位為1。有符號(hào)字可表示的最大正整數(shù)為32767。
歐美品牌停產(chǎn)的,常用的“PLC”備品備件
我司產(chǎn)品應(yīng)用于以下領(lǐng)域:
1,《發(fā)電廠DCS監(jiān)控系統(tǒng)》
2,《智能平鋼化爐系統(tǒng)制造》
3,《PLC可編程輸送控制系統(tǒng)》
4,《DCS集散控制系統(tǒng)》
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5,《智能型消防供水控制系統(tǒng)》
6,《化工廠藥液恒流量計(jì)算機(jī)控制系統(tǒng)》
7,《電氣控制系統(tǒng)》造紙,印染生產(chǎn)線,變電站綜合自動(dòng)化控制系列
本特利,英維思,伍德沃德,??怂共_、西屋、瑞恩、施耐德莫迪康、ABB、AB、西門子、摩托羅拉、GE發(fā)那科、安川、博世力士樂(lè),ACSO,力士樂(lè)等各大品牌的DCS系統(tǒng)配件,機(jī)器人系統(tǒng)配件,大型伺服系統(tǒng)備件。
C62291 Rucker&Kolls R&K 691 Automatic Wafer Prober
CT71086 Karl Suss Wafer Prober Probe Station w/Wild M3Z
K74410 GE LUNAR Prodigy 8743 Bone Densitometer Density
C59276 Orthodyne 20B Ultrasonic Large Wire Bonder
C69693 K&S 4129 Deep Access 90°Wedge Wire Bonder
C64901 K&S Kulicke Soffa 4126 Step-Back Wedge Bonder
C59003 K&S 4123 Manual Wedge Wire Bonder(Refurbished)
C58972 K&S 4123 Manual Wedge Wire Bonder(refurbished)
A73229 Beckman Coulter DU 800 UV/Vis Spectrophotomet?er
C69596 Westbond 7400A Deep Access Vertical Feed Bonder
C64574 HTG 84-3(350W)UV Lamp Mask Aligner w/Power Sup
G51906 Wentworth Labs.MP2000 8″Probe Station
C71219 Westbond 7416A Thermocompressi?on Ribbon Bonder
C59153 Electroglas 2001X Wafer Prober Probe Station
A69438 Applied Materials 8300 Plasma Etch Chamber/Parts
C68471 Signatone CAP-463 Computer Aided 6″Wafer Prober
C69868 Westbond 7416A Thermocompressi?on Wedge Bonder
C69867 Westbond 7700A Deep Access Ball&Wedge Bonder
C64997 Westbond 7416A Thermocompressi?on Wedge Bonder
C70110 Westbond 7700A Deep Access Ball&Wedge Bonder
C70147 Westbond 7200B Pick&Place Epoxy Die Bonder
C70442 Westbond 7700A Ultrasonic Ball&Wedge Bonder
A52247 Inficon UL500 Dry Leybold,Anest Iwata Vac Pump
G53925 Olympus Measuring Microscope System
A72283(3)Tokyo Electron P-8XL Wafer Probers,P-8
C30694 Dage Microtester 22 Wire Shear/Pull Tester BT22
L70134 Kensington Zeiss Wafer Inspection Station
GE43031 Tesec 9210-IH Ambient/Hot IC Handler
GE43128 Tesec 9210-IH.T Ambient/Hot IC Handler
GE43127 Tesec 9210-IH/T Ambient/Hot IC Handler
GE43074 Tesec 9210-IH.T Ambient/Hot IC Handler
GE43073 Tesec 9210-IH Ambient/Hot IC Handler
C69771 Westbond 7316A Eutectic Mech.Scrub Die Bonder
C69694 Westbond 7316A Multiple-Collet Scrub Die Bonder
C69695 Westbond 7300A Eutectic Ultrasonic Die Bonder
C52697 Aetrium 5050S IC Handler for.208mil SSOP
C50941 Electroglas Horizon 4085X Automatic 8″Prober
A55030 Boc Edwards QMB250F Booster w QDP40 Dry Pump
A55032 Boc Edwards QMB250F Booster w/QDP40 Pump
A55031 Boc Edwards QDP40 Vacuum Pump w QMB250F Booster
A59162(2)Credence SC212 Micro Tester System
G69672 K&S(Kulicke&Soffa)1471 Automatic Wire Bonder
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C69225 Mech-El 990 Vertical Feed Wedge Wire Bonder
A24760 SRT MP1000F-IR Chip Bonder/Rework Station,PCB
A24698 Wentworth Laboratories MP2010 Manual Prober,8″
C71102 Alessi REL-4100A 8″Wafer Prober/Probe Station
C52699 Seiko Epson HM-3500 High Speed IC Handler
C52690 Synax SX1201 Pick&Place IC Handler
C71103 Wyko MHT Magnetic Head Tester w/Multi-Axis Stage
A73253 Groton Biosystems Automated Sampling System,ARS
A73252 Packard Topcount NXT Scintillation Counter
A69803 Sonix HS1000 Ultrasonic Microscope HS-1000
G73927 HP G1315A DAD Diode-Array Detector
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A60694 Varian 3400 w/Finnigan Mass Spectrometer
A59351 Nanotech 380FDCR Lapping Machine
C30414 K&S(Kulicke&Soffa)1484 Automatic Wire Bonder