描述
生產(chǎn)者和客戶標(biāo)簽
通訊
由于在RSLogix5000里對(duì)I/O模塊組態(tài)時(shí)采用的是I/O模塊直接連接,致使每個(gè)數(shù)字I/O模塊的占用一個(gè)連接,使得連接數(shù)超出。當(dāng)重做I/O模塊組態(tài)采用機(jī)架優(yōu)化連接,這樣一來(lái)I/O模塊的連接壓縮到了一個(gè)機(jī)架優(yōu)化連接內(nèi),節(jié)省了連接數(shù)量和帶寬。
2.NUT、RPI、帶寬
NUT(NetworkUpdateTime)、RPI(RequestedPacket
Interval)這兩個(gè)參數(shù)在網(wǎng)絡(luò)中常常影響到網(wǎng)絡(luò)的帶寬,使得網(wǎng)絡(luò)不暢通或效率不高。在理論上來(lái)說(shuō)當(dāng)帶寬在60%~70%網(wǎng)絡(luò)效率較高,當(dāng)帶寬不夠時(shí)就應(yīng)該減少NUT與RPI時(shí)間。另外NUT,RPI之間按一定的關(guān)系來(lái)確定數(shù)值,也能提高網(wǎng)絡(luò)效率減少帶寬,即RPI=2nNUT。
3.安裝
除了軟件設(shè)置,安裝不合格同樣會(huì)引起很多問(wèn)題。
敷設(shè)ControlNet網(wǎng)絡(luò)的RG6電纜保護(hù)要做好。電纜破損,分支器進(jìn)水以及BNC頭做得不好都將影響網(wǎng)絡(luò)的暢通。在網(wǎng)線敷設(shè)好后,分支器不聯(lián)入節(jié)點(diǎn),裝上終端電阻,測(cè)量分支器聯(lián)入節(jié)點(diǎn)的BNC芯線與外層電阻應(yīng)在37.5~43Ω之間,小于37.5則有短路現(xiàn)象,過(guò)大則接觸不好。BNC頭的制作建議使用1786-CTK專用工具制作,在工具箱內(nèi)光盤中有制作的全過(guò)程的影像文件。
DeviceNet
網(wǎng)絡(luò)采用的五芯屏蔽電纜,注意不要接錯(cuò),另外當(dāng)電纜接入分接器時(shí),線頭如不燙錫或不使用接線鼻,很容易斷線引起網(wǎng)絡(luò)不通,所以要特別注意。
FlexI/O中經(jīng)常有能掃描到站點(diǎn)而掃描不到模塊或個(gè)別模塊的現(xiàn)象,這主要是由于使用的安裝軌道不平整或質(zhì)量不高,以至于模塊底座安裝不穩(wěn),底座之間聯(lián)接不可靠引起。拆下模塊重新安裝到位即可。建議使用質(zhì)量高不易變形的安裝導(dǎo)軌安裝FlexI/O。
歐美品牌停產(chǎn)的,常用的“PLC”備品備件
我司產(chǎn)品應(yīng)用于以下領(lǐng)域:
1,《發(fā)電廠DCS監(jiān)控系統(tǒng)》
2,《智能平鋼化爐系統(tǒng)制造》
3,《PLC可編程輸送控制系統(tǒng)》
4,《DCS集散控制系統(tǒng)》
?
5,《智能型消防供水控制系統(tǒng)》
6,《化工廠藥液恒流量計(jì)算機(jī)控制系統(tǒng)》
7,《電氣控制系統(tǒng)》造紙,印染生產(chǎn)線,變電站綜合自動(dòng)化控制系列
本特利,英維思,伍德沃德,??怂共_、西屋、瑞恩、施耐德莫迪康、ABB、AB、西門子、摩托羅拉、GE發(fā)那科、安川、博世力士樂(lè),ACSO,力士樂(lè)等各大品牌的DCS系統(tǒng)配件,機(jī)器人系統(tǒng)配件,大型伺服系統(tǒng)備件。
N59276 Orthodyne 20B Ultrasonic Large Wire Bonder
C64901 K&S Kulicke Soffa 4126 Step-Back Wedge Bonder
N59003 K&S 4123 Manual Wedge Wire Bonder (Refurbished)
C58972 K&S 4123 Manual Wedge Wire Bonder (refurbished)
C69693 K&S 4129 Deep Access 90° Wedge Wire Bonder
C64574 HTG 84-3 (350W) UV Lamp Mask Aligner w/Power Sup
G51906 Wentworth Labs. MP2000 8″ Probe Station
C69596 Westbond 7400A Deep Access Vertical Feed Bonder
C64997 Westbond 7416A Thermocompressi?on Wedge Bonder
C70110 Westbond 7700A Deep Access Ball & Wedge Bonder
C70147 Westbond 7200B Pick & Place Epoxy Die Bonder
C70442 Westbond 7700A Ultrasonic Ball & Wedge Bonder
C71219 Westbond 7416A Thermocompressi?on Ribbon Bonder
A69438 Applied Materials 8300 Plasma Etch Chamber/Parts
C68471 Signatone CAP-463 Computer Aided 6″ Wafer Prober
C69868 Westbond 7416A Thermocompressi?on Wedge Bonder
C69867 Westbond 7700A Deep Access Ball & Wedge Bonder
G53925 Olympus Measuring Microscope System
A52245 Inficon UL500 Dry w Tri-Scroll Pump, Leybold
A52247 Inficon UL500 Dry Leybold, Anest Iwata Vac Pump
C30694 Dage Microtester 22 Wire Shear/Pull Tester BT22
GE43128 Tesec 9210-IH.T Ambient/Hot IC Handler
GE43127 Tesec 9210-IH/T Ambient/Hot IC Handler
GE43074 Tesec 9210-IH.T Ambient/Hot IC Handler
GE43073 Tesec 9210-IH Ambient/Hot IC Handler
L70134 Kensington Zeiss Wafer Inspection Station
GE43031 Tesec 9210-IH Ambient/Hot IC Handler
C50941 Electroglas Horizon 4085X Automatic 8″ Prober
C69771 Westbond 7316A Eutectic Mech. Scrub Die Bonder
C69694 Westbond 7316A Multiple-Collet Scrub Die Bonder
C69695 Westbond 7300A Eutectic Ultrasonic Die Bonder
C52697 Aetrium 5050S IC Handler for .208mil SSOP
A72283 (3) Tokyo Electron P-8XL Wafer Probers, P-8
C67229 Mech-El 907 1mil Wire Vertical Feed Wedge Bonder
C52686 TSK A-PM-90A Automatic 8″ Wafer Prober
C70111 Mech-El 990 Vertical Feed Wedge Wire Bonder
N66463 Signatone S-1160 Probing Station w/SZ4045
C50995 Isel Robotik Wafer Handling Robot Newly Upgraded
C70446 Mech-El 907 Manual Wedge Wire Bonder
A55030 Boc Edwards QMB250F Booster w QDP40 Dry Pump
A55032 Boc Edwards QMB250F Booster w/ QDP40 Pump
A55031 Boc Edwards QDP40 Vacuum Pump w QMB250F Booster
A59162 (2) Credence SC212 Micro Tester System
G69672 K&S (Kulicke & Soffa) 1471 Automatic Wire Bonder
C69225 Mech-El 990 Vertical Feed Wedge Wire Bonder
A24760 SRT MP1000F-IR Chip Bonder/ Rework Station, PCB
A24698 Wentworth Laboratories MP2010 Manual Prober, 8″
C71102 Alessi REL-4100A 8″ Wafer Prober / Probe Station
C52699 Seiko Epson HM-3500 High Speed IC Handler
C52690 Synax SX1201 Pick & Place IC Handler
C71103 Wyko MHT Magnetic Head Tester w/Multi-Axis Stage
A66345 Quality Transformer Assembly 400 kVA, AMAT
A66349 Edwards QDP80/ QMB250F Pump System w/ Booster
N69803 Sonix HS1000 Ultrasonic Microscope HS-1000
A60694 Varian 3400 w/ Finnigan Mass Spectrometer
A59351 Nanotech 380FDCR Lapping Machine
C30414 K&S (Kulicke & Soffa) 1484 Automatic Wire Bonder
C52688 TSK A-PM-90AL Automatic 8″ Wafer Probing Prober
C69941 Westbond 7440A Insulated Wire Bonder Tacker
C64996 Westbond 7200AA Pick & Place Epoxy Die Bonder
C72243 HP 54845A Infiniium 1.5GHz 8GSa/s Oscillscope
C69770 Westbond 7200A Pick & Place Epoxy Die Bonder
C30499 Dage BT23 Shear Tester w/ LC200 Load Cell
C68597 HP 54845A Infiniium 1.5GHz 8GSa/s Oscillscope
Y72319 Anritsu MS2721A Spectrum Master Analyzer MS2721B
C51192 Tektronix DTG 5274 Data Timing Generator 2.7Gb/s
C51191 Tektronix DTG 5274 Data Timing Generator 2.7Gb/s