描述
J-STD-001B規(guī)定:A離子污染物含量:<1.56μgNaCl/cm2;B助焊劑殘留量:一級(jí)<200μgNaCl/cm2,二級(jí)<100μgNaCl/cm2, 三級(jí)< 40μgNa-Cl/cm2;C平均絕緣電阻>1*108Ω,(log10)的標(biāo)準(zhǔn)差<3.2、IPC-SA-61按工藝規(guī)定的值。3、MIL-STD-2000A規(guī)定離子污染物含量<1.56μgNaCl/cm2。合明科技針對(duì)PCBA焊后清洗研發(fā)的水基型清洗劑,產(chǎn)品具有配方溫和、清洗力強(qiáng)、清洗時(shí)間短、效能高、氣味清淡、不含鹵素,對(duì)FPC等板材所用敏感金屬及電子元器件等均具有良好的材料兼容性、使用壽命長(zhǎng)、清洗負(fù)載力高、維護(hù)成本低等特點(diǎn)。
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